The modular design of the scratch-built industrial camera really stacks up

The news here is not so much [Guarav Singh] This high-quality industrial digital camera is made from scratch, but that’s the way it was done. This is of course the amount of information packed into the text. And excellent photography.

Modularity was one of them [Guarav]Design goals with the intention of being able to replace the sensor as technology changes. To that end, [Guarav] Came up with a stack of three PCBs. The middle board of the stack has a Lattice FPGA chip with two 16-MB RAM and an FPGA configured flash. The sensor board is on one side of the FBGA board, while the USB 3.0 board is on the other. Each six-tiered board is a masterpiece of high-density design, and the engineering that is used to interface them and press everything into a 3D-printed case, including an integrated aluminum C-mount ring, is quite impressive.

[Guarav]The FPGA contains details on its processing of sensor data. Also, there is some practical information on the implementation of MIPI (Mobile Industry Processor Interface) and CSI (Camera Serial Interface) specifications. We’ve entered this world before, but this project is a great hands-on explanation that can really help you move your MIPI project forward.

Thanks for the tip, [STR-alorman].

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